Ose machipsets anoshandiswa mune akateedzana mafoni Galaxy S22, Exynos 2200 uye Snapdragon 8 Gen 1, vane nzara yesimba uye kupisa zvakanyanya, zvichikonzera kuodza mwoyo kuita kwemitambo uye hupenyu husina kunaka hwebhatiri. Anenge mamwe ese maflagship anotarisana nedambudziko iri Android mafoni kubva gore rino. Nekudaro, Samsung inotevera foldable smartphones inogona kuvadzivisa.
Zvinoenderana neanoremekedzwa Ice universe leaker, pachave ne "benders" Galaxy Kubva Fold4 a Kubva paFlip4 inofambiswa neiyo Snapdragon 8 Gen 1+ chipset (dzimwe nguva yakanyorwa seSnapdragon 8 Gen 1 Plus). Qualcomm haisati yaburitsa chip, asi maererano neanecdotal mishumo, yakavakirwa paTSMC's 4nm process, ichiita kuti iwedzere simba-inoshanda kana ichienzaniswa neExynos 2200 uye Snapdragon 8 Gen 1 (machipi aya anogadzirwa uchishandisa Samsung's 4nm maitiro).
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Iyo semiconductor chip yekugadzira tekinoroji kumafekitori eTSMC yagara iri pamusoro kune iyo inoshandiswa neSamsung's foundry division, Samsung Foundry. Hazvishamise kuti iyo Taiwanese semiconductor hofori yakasarudzawo kugadzira yayo A uye M yakatevedzana chipsets mumakore mashoma anotevera. Apple.
Unogona kufarira
Kunyange izvi zvichiodza moyo kune Samsung Foundry, yeSamsung MX (Mobile Experience) division, iyo inogadzira mafoni uye mahwendefa pakati pezvimwe zvinhu. Galaxy, pane kudaro, mashoko akanaka. Zvinogona kutarisirwa izvozvo Galaxy Z Fold4 uye Z Flip4 ichapa kushanda kwepamusoro uye hupenyu hwebhatiri pane dzakateerana Galaxy S22 uye chizvarwa chazvino cheSamsung "puzzles".
