Qualcomm yakatanga yazvino mureza chipset mazuva mashoma apfuura Snapdragon 8 Gen1, iyo inogadzirwa neSamsung's 4nm process. Nekudaro, ikozvino zvinoita sekunge zvese hazvina kunyatso kurongeka pakati peQualcomm neSamsung uye kuti panogona kuve nekumwe shanduko maererano nekugadzirwa kwechip chip.
Maererano ne digitimes.com, Qualcomm haina kugutsikana negoho reSamsung Foundry's 4nm kugadzira maitiro. Kana matambudziko ekugadzira akaramba, kambani inonzi inokwanisa kushandura imwe kugadzirwa kweSnapdragon 8 Gen 1 kubva kuSamsung kuenda kumukwikwidzi wayo mukuru TSMC.
Sekureva kwedzimwe nyanzvi, maitiro ekugadzira eTaiwanese semiconductor hofori akakwirira kune Samsung maererano nehukuru uye kushanda nesimba. Kana Qualcomm yafunga kuve neimwe Snapdragon 8 Gen 1 machipi anogadzirwa achishandisa Samsung maitiro uye vamwe vachishandisa maitiro eTSMC, panogona kuve nemusiyano mukuita uye kushandiswa pakati pezviviri izvi.
Samsung inotevera mureza chip inofanirawo kugadzirwa uchishandisa iyo 4nm maitiro Exynos 2200, uye kana vakadaro informace webhusaiti chaiyo, mutsara Galaxy S22 inogona kutarisana nedambudziko rekushomeka kwechip. Pamusoro pezvo, kurasikirwa nechikamu chechibvumirano chekugadzira chip nemutengi mukuru seQualcomm kunogona kukuvadza Samsung's semiconductor bhizinesi uye kukanganisa hurongwa hwayo hweku "kubvarura" TSMC panosvika 2030.
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