Qualcomm yakatotangisa mureza wayo wegore rino Snapdragon 888 uye maererano nemishumo isiri pamutemo, inofanirwa kuunza itsva yepakati-renji Snapdragon 775 chipset, iyo inotsiva iyo Snapdragon 765, pakupera kwemwedzi.
Nekudaro, iyo inovuza yakanyarara pane inonyanya kukosha - kurongeka kwema processor cores uye kuwanda kwavo. Zvese zvazvinotaura ndezvekuti Snapdragon 775 ichave yakashongedzerwa neKryo 6xx cores, asi izvo zvinogona kureva chero chinhu.
Kufanana neSnapdragon 888, chipset inofanira kuvakwa pane 5nm maitiro, inotsigira LPDDR5 ndangariro nekumhanya kwe3200 MHz uye LPDDR4X nekumhanya kwe2400 MHz uye UFS 3.1 kuchengetedza.
Iyo leak inotaurawo nezve Spectra 570 mufananidzo processor, inotsigira 4K vhidhiyo kurekodha pa60 fps, matatu panguva imwe chete anoshanda masensa ane resolution ye28 MPx kana maviri sensors ane resolution ye64 uye 20 MPx.
Panyaya yekubatanidza, chipset inonzi inotsigira maviri 5G uye millimeter mafungu, VoNR (Voice pamusoro pe5G New Radio) basa, Wi-Fi 6E yakajairwa ine 2 × 2 MIMO tekinoroji uye NR CA, SA, NSA uye Bluetooth 5.2 zviyero. Inosanganisira iyo WCD9380/WCD9385 audio chip.
Kuita kwechipset kwakamboyerwa mubenchmark yeAnTuTu, uko kwaive ne65% nekukurumidza kupfuura iyo Snapdragon 765 (uye ingangoita gumi nemaviri% inononoka kupfuura yegore rapfuura mureza Qualcomm Snapdragon 12+ chip).
Panguva ino, hazvizivikanwe kuti ndeupi mudziyo uchashandisa Snapdragon 775 (kwete iro zita repamutemo) kutanga.
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