Iyo Snapdragon 875 yakarova iyo Kirin 9000 mune yazvino bhenji

Kuita kweQualcomm's coming flagship chip, Snapdragon 875, yakayerwa mune imwe bhenji, kwayakakwanisa kurova Huawei's new flagship chipset, Kirin 9000. Kunyanya, Snapdragon 875 yakawana huwandu hwe899 mapoinzi mu Master Lu benchmark, ichirova iyo Kirin 401 neinenge 9000% (uye yazvino mureza chip Qualcomm Snapdragon 3 ne865%).

Izvo zvinofanirwa kucherechedzwa pano kuti iyo Snapdragon 875 yakaedzwa yaive sampu yeinjiniya (kureva kwete chishandiso chekutengesa), saka mhedzisiro inozoitika inogona kusiyana, kumusoro nekudzika.

Muiyo Snapdragon 875 processor bvunzo, yakawana 333 mapoinzi, ichirova iyo Kirin 269 ne9000% uye yakaitangira ne17%. Nekudaro, iyo Kirin 13 yakaratidza simba rayo muiyo giraidhi chip bvunzo, kwayakawana 9000 mapoinzi, ichirova iyo Snapdragon 344 neinenge muzana uye Snapdragon 334 neinenge 875%. musimboti vhezheni yeMali-G14,5 GPU, nepo Snapdragon 865 Adreno 9000 chip maererano neruzivo rusina pamutemo.

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Pavel Varenka

3. 11. 2020

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Izvo zvakakoshawo kuwedzera kuti michina yakaedzwa chipsets yaive ne12 GB ye RAM, uye kuti Huawei Mate 40 Pro foni ine yazvino Kirin yaive neimwe mukana wekukurumidza kuchengetedza.

Zvinonakidza kutaura kuti iyo Snapdragon 875 ine simba rakawanda kupfuura iyo Kirin 9000 kunyangwe iyo huru processor core inomhanya pamhepo ye2,84 GHz (sezviri muSnapdragon 865), nepo "hombe" musimboti weKirin 9000 wakavharwa. pa 3,13 GHz.

Kuita kweSnapdragon 875 kwakamboyerwawo mune yakakurumbira AnTuTu bhenji, uko chip yakahwina mapoinzi angangoita 848 uye yakatsika-tsika foni yakakurumidza neiyo "plus" musiyano weSnapdragon 000 ROG Runhare 865, iyo yakasvika ingangoita mazana matanhatu nemakumi mapfumbamwe nemapfumbamwe mapoinzi.